China Iibhodi zeSekethe ezigqwesileyo kuMzi-mveliso waseShenzhen Umboneleli wePCB PCBA Dibanisa uMvelisi weNkonzo
INGCACISO YOMVELISO:
Izinto ezisisiseko: | FR4-TG140 | Ukugqitywa komphezulu: | I-HASL(Khokela Mahala) |
Ukutyeba kwePCB: | 1.6mm | Imaski yeSolder: | Luhlaza |
Ubungakanani bePCB: | 90*160mm | Isikrini sesilika: | Mhlophe |
Ubalo lomaleko: | 2/L | Cu Ukutyeba | 35um(1oz) |
Uhlobo lokuNyusa: | SMT+DIP | Iphakheji ye-SMT | 0201,BGA, QFN |
Inkonzo yoVavanyo | I-AOI, iX-Ray, uvavanyo lokuSebenza | Uhlobo lomthengisi | Umzi-mveliso weNdibano |
TurnkeyIzixhobo:
1. Ukwenziwa kwePCB
2. I-PCBA ye-Turnkey: I-PCB+inxalenye+SMT kunye nendibano yomngxuma wokutyhutyha+umngxunya wokubumba&nezindlu
Imveliso ephambili:
Inzuzo yethu:
1, programming kunyeFuvavanyo olungasebenziyo
2, IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% funcuvavanyo lwesizwe.
3, Inkonzo yobungcali.I-ISO SMT kunye nendibano yomngxuma, ngaphezulu kweminyaka eyi-10 yamava.
4,Isiqinisekiso: 94v-0, CE, SGS, FCC, RoHS, ISO9001:2008, ISO14001
5,Ixesha lewaranti yePCBA: iminyaka emi-2.
I-PCBA UKWENZA INKQUBO:
Turnkey PCBA | PCB+inxalenye yokufumana+indibano+iphakheji |
Iinkcukacha zeNdibano | I-SMT kunye ne-Thru-hole,Indibano ebiyelweyo yePCB |
Ixesha lokukhokhela | Umzekelo:10-12umsebenzingeiintsuku.Umyalelo omkhulu:18~20hayiukumkaniiintsuku |
Uvavanyo kwiimveliso | Uvavanyo lweFlying Probe,Uvavanyo lwe-E,Ukuhlolwa kwe-X-ray, uvavanyo lwe-AOI, uvavanyo olusebenzayo |
Ubungakanani | Ubungakanani obuncinci: 1pcs.Iprototype, iodolo encinci, i-mass order |
Iifayileuhlobo | PCB: Iifayile zeGerber(CAM, PCB,PCBDOC) |
Amacandelo: IBhili yeMathiriyeli (uluhlu lweBOM) | |
Indibano: Khetha&Beka ifayile, Umzobo weNdibano | |
Ubungakanani bePaneli yePCB | Ubungakanani obuncinci: 0.25 * 0.25 intshi (6 * 6mm) |
Ubungakanani obukhulu: 20*20 intshi (500*500mm) | |
Uhlobo lweSolder yePCB | I-Soluble Solder Paste yaManzi, i-RoHS ikhokela simahla |
Iinkcukacha zamacandelo | Yehla ukuya ku-01005ubukhulu |
BGA kunyeQFN yeChip | |
INdibano ye-SMT enamacala amabini | |
I-Pitch entle ukuya kwi-0.8mils | |
Ukususwa kwenxalenye kunye noTshintsho | |
Iphakheji yecandelo | Sika iTape, iTube, iiReels, iindawo ezikhululekileyo |
ISAKHONO SOKUSEBENZA KWE-PCB:
1 | Iileya | 1-32Umaleko |
2 | Uhlobo lwezinto zebhodi | FR4,Cibhodi ye-eramic substrate,ibhodi aluminiyam esekwe, high-Tg, Rogers kunye nokunye |
3 | I-lamination yezinto ezidibeneyo | 4 ukuya kwi-6 imigangatho |
4 | Ubuninzi bomlinganiselo | 600x1200mm |
5 | Ukugubungela ubukhulu bebhodi | 0.2 ukuya 6.00mm |
6 | Ubuncinci bobubanzi bomgca | 3mil |
7 | Ubuncinci besithuba somgca | 3mil |
8 | Umaleko wangaphandle ubukhulu bobhedu | 8.75 ukuya 175µm |
9 | Umaleko wangaphakathi ubukhulu bobhedu | 17.5 ukuya 175µm |
10 | Ukugrumba umngxuma ubukhulu (ukuqhuba ngomatshini) | 0.25 ukuba 6.00mm |
11 | Idayimitha yomngxuma egqityiweyo (uqheliso lomatshini) | 0.20 ukuba 6.00mm |
12 | Unyamezelo lwedayamitha yomngxuma (ukuqhuba ngomatshini) | 0.05mm |
13 | Unyamezelo lwendawo yomngxuma (ukuqhuba ngomatshini) | 0.075mm |
14 | Laser drill ubungakanani umngxuma | 0.10mm |
15 | Ubukhulu bebhodi kunye nomlinganiselo wedayamitha yomngxuma | 10:1 |
16 | Uhlobo lwemaski yeSolder | Buhlaza, Mthubi, Mnyama, Msobo, Buso, Mhlophe naBomvu |
17 | Ubuncinci imaski yesolder | Ø0.10mm |
18 | Ubuncinci bobungakanani beringi yokwahlula imaski ye-solder | 0.05mm |
19 | I-Solder imaski yeplagi yeplagi ye-oyile yomngxuma ububanzi | 0.25 ukuba 0.60mm |
20 | Ukunyamezela kokulawula ukunyamezela | ±10% |
21 | Ukugqitywa komphezulu | I-HASL(Khokela Mahala), i-ENIG, isilivere yokuntywiliselwa, igolide, i-tin yokuntywiliselwa kunye nomnwe wegolide |
Ukuhanjiswa ngokukhawuleza:
PCBIn Iiyure eziyi-12
PCBA Ngeentsuku ezintathu
Usetyenziso lweeMveliso eziPhambili:
*IiMveliso zonyango
* Iimveliso zeemoto
* IiMveliso zoShishino
* Iimveliso zoNxibelelwano (AVL/GPS/GSM Izixhobo)
* I-Electronics yabathengi.
IiNkqubo zeNdibano zePCB:
* Ulawulo lweNkqubo
IiFayile zePCB → iDCC → Ulungiselelo lweNkqubo → UPhuculo → Ukujonga
* Ulawulo lwe-SMT
Isilayishi sePCB → Isishicileli seSkrini → Ukukhangela → Ukubekwa kwe-SMD → Ukukhangela → Ukuqukuqela kwakhona komoya → Uhlolo lombono → AOI → Ukugcina
* Ulawulo lwePCBA
THT→Amaza okuSoldering (I-Welding Manual) → Ukuhlolwa kombono → ICT → Flash → FCT → Ukukhangela → Ipakethe → Ukuthunyelwa
I-PHILIFAST ikubonelela ngeyona PCB ilungileyo yokwenza kunye namava endibano